ELECTRONICS TECHNOLOGY
Abstract
The Electronics Technology Program Element is budgeted in the Applied Research Budget Activity because its objective is to develop electronics that make a wide range of military applications possible. The Electronics Technology Project focuses on turning basic advancements into the underpinning technologies required to address critical national security issues and to enable an information-driven warfighter. This Program Element also supports innovation and robust transition planning in the technology cycle by working with entrepreneurs to increase the likelihood that DARPA funded technologies take root in the U.S. and provide new capabilities for national defense. Advances in microelectronic device technologies continue to significantly benefit improved weapons effectiveness, intelligence capabilities, and information superiority. The Electronic Technology project supports continued advancement in microelectronics, including electronic and optoelectronic devices, Microelectromechanical Systems (MEMS), semiconductor device design and fabrication, and new materials and material structures. Areas of particular emphasis of this work include reducing the barriers to designing and fabricating custom electronics and exploiting improved manufacturing techniques to provide low-cost, high-performance sensors. Programs in this project will also greatly improve the size, weight, power, and performance characteristics of electronic systems; support positioning, navigation, and timing in GPS-denied environments; and develop sensors more sensitive and robust than today's standards. This project has six major focus areas: Electronics, Photonics, Microelectromechanical Systems, Architectures, Algorithms, and other Electronic Technology research. The Beyond Scaling Technology project recognizes that, within the next decade, the continuous pace of improvements in electronics performance will face the fundamental limits of silicon technology. This project pursues electronics performance advancements that exploit new concepts in circuit specialization by the optimization of materials, devices, architectures, and designs to achieve specific circuit function at high performance. Because electronics advancements must simultaneously make progress in performance and secure the foundation on which our digital infrastructure relies, this envisioned electronics specialization will require incorporation of security safeguards. Accordingly, programs within the Beyond Scaling project will reduce barriers to making specialized circuits in today's silicon hardware and significantly increase the ease with which DoD can design, deliver, and eventually upgrade critical, customized electronics. Programs also explore alternatives to traditional circuit architectures, for instance by exploiting vertical circuit integration to optimize electronic devices and by incorporating novel materials and new techniques for securing DoD and commercial data and hardware.
Document Details
- Document Type
- R2 Budgetary Justification
- Publication Date
- Oct 01, 2023
- Source ID
- 0602716E_2_0400_PB_2023
- Change Summary Explanation
- FY 2021: Decrease reflects reprogrammings and SBIR/STTR transfer. FY 2022: Increase reflects a Congressional add for ERI 2.0. FY 2023: FY 2023 funding increase reflects the fact that the FY 2022 President's Budget request did not include out-year funding.
- Service Agency Name
- Defense Advanced Research Projects Agency
Entities
Organizations
- Defense Advanced Research Projects Agency
Related Documents
- Child Project: ELECTRONIC TECHNOLOGY
- Child Accomplishment: Focal Arrays for Curved Infrared Imagers (FOCII)
- Child Accomplishment: Wideband Adaptive RF Protection (WARP)
- Child Accomplishment: Quantum Imaging of Vector Electromagnetic Radiation (QuIVER)
- Child Accomplishment: Fast Event-based Neuromorphic Camera and Electronics (FENCE)
- Child Accomplishment: Quantum Apertures (QA)
- Child Accomplishment: Waveform Agile Radio-frequency Directed Energy (WARDEN)
- Child Accomplishment: Generating RF with Photonics for low Noise (GRYPHON)
- Child Accomplishment: Compact High Intensity Radiating Photonics (CHIRP)
- Child Accomplishment: Atomic Magnetometry for Biological Imaging In Earth's Native Terrain (AMBIIENT)
- Child Accomplishment: Modular Optical Aperture Building Blocks (MOABB)
- Child Accomplishment: Dynamic Range-enhanced Electronics and Materials (DREaM)
- Child Project: BEYOND SCALING TECHNOLOGY
- Child Accomplishment: Digital RF Battlespace Emulator (DRBE)
- Child Accomplishment: Low Temperature Logic Technology (LTLT)
- Child Accomplishment: Automatic Implementation of Secure Silicon (AISS)
- Child Accomplishment: Lasers for Universal Microscale Optical Systems (LUMOS)
- Child Accomplishment: COmpact Front-end Filters at the ElEment-level (COFFEE)
- Child Accomplishment: ELectronics for G-band ARrays (ELGAR)
- Child Accomplishment: Data Privacy for Virtual Environments (DPRIVE)
- Child Accomplishment: Quantum Inspired Classical Computing (QuICC)
- Child Accomplishment: Guaranteed Architectures for Physical Security (GAPS)
- Child Accomplishment: Massive Cross Correlation (MAX)
- Child Accomplishment: Structured Array Hardware for Automatically Realized Applications (SAHARA)*
- Child Accomplishment: Ferroelectric Computing (FC)
- Child Accomplishment: Technologies for Rapid Assembly of Microsystems (TRAM)
- Child Accomplishment: Reconfigurable, Actionable, Passive Technologies for Operational Remote Sensing (RAPTORS)
- Child Accomplishment: Robust Electronics for Radiative Environments (RE2)
- Child Accomplishment: Next Generation Microelectronics - Advanced Manufacturing Tools
- Child Accomplishment: Next Generation Microelectronics - Advanced Manufacturing Approaches for three-dimensional heterogeneous integration (3DHI)
- Child Accomplishment: Next Generation Microelectronics - Advanced Manufacturing for Extreme Environment Electronics
- Child Accomplishment: Next Generation Microelectronics Prototyping Designs
- Child Accomplishment: Beyond Scaling - Materials
- Child Accomplishment: Beyond Scaling - Architectures
- Child Accomplishment: Beyond Scaling - Design
- Child Accomplishment: System Security Integrated Through Hardware and firmware (SSITH)
- Child Accomplishment: Hierarchical Identify Verify Exploit (HIVE)
- Child Accomplishment: Common Heterogeneous integration and IP reuse Strategies (CHIPS)