Beyond Scaling - Materials
Abstract
The Beyond Scaling - Materials program is demonstrating the integration of novel materials into next-generation logic and memory components. This program is pursuing potential enhancements in electronics that do not rely on Moore's Law, i.e. silicon transistor scaling, including research into new materials and the implications of those materials at the device, algorithm, and packaging levels. Research areas include heterogeneous integration of multiple materials, "sticky logic" and novel transistor devices that combine elements of computation and memory, and three-dimensional vertical circuit integration to demonstrate dramatic performance improvements using older silicon technologies. Further research supports innovation in the technology cycle by working with entrepreneurs focused on DoD-relevant businesses. Basic research for this program is funded within PE 0601101E, Project ES-02.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2023
- Source ID
- 7580efa0d97c347c5fb5710cfe78ff82
Related Documents
- Root: ELECTRONICS TECHNOLOGY