Microelectronics
Abstract
Microelectronics components are the foundation of modern military systems. The Department of Defense (DoD) is exposed to various vulnerabilities that threaten the ability to source microelectronics needed to sustain programs of record. In order to prepare the Department for Great Power Competition, the DoD must take action to ensure access to the microelectronic components needed to sustain our defense programs and systems effectively and affordably. The Department also needs a better strategy to transition leading edge technology developed by both government and industry to DoD programs of record, to ensure the Department maintains a competitive edge. As part of the response to Executive Order 13806, "Assessing and Strengthening the Manufacturing and Defense Industrial Base and Supply Chain Resiliency of the United States," July 21, 2017, the Office of the Under Secretary of Defense for Acquisition and Sustainment (OUSD(A&S)) undertook a study of the global microelectronics industry, the state of the defense microelectronics supply chain, and the Department's ability to sustain programs of record. The study revealed the domestic microelectronics industry is shrinking, with the United States consuming 34 percent of global demand and producing less than 12 percent of supply. The DoD: •is heavily reliant on microelectronics produced in foreign countries or by firms coming increasingly under the influence of foreign adversaries. A large number of these parts are present in many key DoD systems; •has very poor supply chain visibility; •could find critical components needed to sustain or build programs of record unavailable due to a conflict, embargo, or natural disaster due to the reliance foreign parts; and •has few sources of the radiation-hardened microelectronics and limited radiation test facilities resources needed by systems for nuclear modernization, our highest priority.
Document Details
- Document Type
- Project
- Publication Date
- Oct 01, 2022
- Source ID
- 821_0607210D8Z_7_0400_PB_2022
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