Address DoD Unique Needs Radiation Hardening and non-CMOS - Demonstration
Abstract
This project addresses the dual problems of commanding only a small market share while requiring an expansive range of unique microelectronics needs, from boutique and legacy components to state-of-the-art (SOTA) technologies. The Government must sustain specialty suppliers, given their criticality to national security. In particular, DoD needs access to a diverse microelectronics ecosystem to develop and acquire the application specific integrated circuit (ASICs) and personalized commercial off the shelf (COTS) components required for military radiation hardened and radio frequency and optical needs. The Department frequently relies on commercial suppliers to optimize performance and reduce costs for sophisticated weapon system and secure network functionality. It is critical that the DoD has future access to subject matter expertise, technology, and manufacturing. In addition to Rad Hard needs, the DoD requires access to RF and opto-electronic materials, foundries, and packaging facilities, in order to enable next generation sensors and communications. The DoD must leverage state-of-the-art microelectronic technologies driven by mega-trends such as 5G wireless and datacenters in order to combat emerging threats and provide overmatch technology to the warfighter. At the same time, the DoD must fill the gaps which are left unaddressed these dual-use mega-trends in order to satisfy mission requirements. By partnering in the maturation of state-of-the-art material sources, foundries, and packaging facilities, the DoD is able to tailor process development towards unique DoD interests and encourage open access design, which stimulates innovation and drives affordability. Additionally, critical investments must be made in the domestic supply chains supporting both RF Gallium Nitride (GaN) and integrated photonics in order to maintain the integrity and security of the Defense Industrial Base.
Document Details
- Document Type
- Project
- Publication Date
- Oct 01, 2023
- Source ID
- 905_0605294D8Z_5_0400_PB_2023
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