Trusted and Assured Microelectronics
Abstract
This program supports the Department's initiatives to Build Sustainable and Long-Term Advantage, Defend the Homeland, and Deter Aggression. This program supports microelectronics modernization activities that enable defense systems to keep pace with commercial microelectronics technological advances, reduce reliance on obsolete microelectronics, and mitigate the Department’s reliance on sole source foundries for assured state-of-the-art (SOTA) microelectronics. It addresses the challenges of 1) having enduring access to a multiplicity of modern manufacturing processes that require commercial volumes to maintain long term viability and 2) protecting the intellectual property (IP) of the microelectronic parts that are manufactured. This program supports the National Defense Strategy (NDS) for 2018's line of effort to build a more lethal force through modernization of key capabilities, the NDS defense objective of establishing an unmatched twenty-first century National Security Innovation Base that effectively supports Department operations and sustains security and solvency, and the NDS strategic approach of reforming the Department’s business practices by simultaneously increasing performance and affordability while still minimizing risk. This Program Element supports the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)) Microelectronics Modernization Roadmap. The primary areas of focus of this roadmap include the following: access to state-of-the-art (SOTA) microelectronics technology, access to advanced packaging and test; quantifiable assurance and secure design; foundry access; verification and validation; policies, standards, and Joint Federated Assurance Center (JFAC) governing body; access to radiation hardened microelectronics; access to non-complementary metal oxide semiconductor (CMOS) SOTA microelectronics for radio frequency and optoelectronic applications; disruptive research and development; education and workforce development; trusted foundry and obsolescence; and supply chain awareness and security. Recognizing that an assured supply of microelectronics is a U.S. Government-wide concern, this activity will interface with interagency partners to take into account interagency requirements, opportunities for collaboration, and strategic decisions that can be made to limit the overall cost of these requirements to the USG. This activity is being led by the Under Secretary of Defense for Research and Engineering.
Document Details
- Document Type
- R2 Budgetary Justification
- Publication Date
- Oct 01, 2023
- Source ID
- 0605294D8Z_5_0400_PB_2023
- Change Summary Explanation
- In FY 2021, Program Element (PE) funding was re-aligned under three new project codes to correctly align Program Element (PE) funding in support of a Quantifiable Assurance philosophy and reflective of current priorities. The new project codes are: (1) Project Code 902 Access to State-of-the-Art (SOTA) Microelectronics - Demonstration; (2) Project Code 903 Access to Advanced Packaging and Testing - Demonstration; and (3) Project Code 905 Address DoD Unique Needs - Radiation Hardening and non-CMOS - Demonstration. A Congressional rescission of $8.216 million was enacted as part of the FY 2022 Appropriation reducing the available FY 2021 budget to $95.964 million. FY 2023 funding increase reflects the fact that the FY 2022 President’s Budget request did not include out-year funding. The FY 2023 funding request was reduced by -$17.749 million to account for the availability of prior year execution balances.
- Service Agency Name
- Office of the Secretary Of Defense
Entities
Organizations
- Office of the Secretary of Defense
Related Documents
- Child Project: Access to State-of-the-Art (SOTA) Microelectronics - Demonstration
- Child Accomplishment: Design
- Child Accomplishment: Foundry
- Child Accomplishment: Secure Design and Quantifiable Assurance Demonstration
- Child Accomplishment: Microelectronics Ecosystem
- Child Cost Item: 33da4aa45ab4cb3df9f5364972cd2f43
- Child Project: Access to Advanced Packaging and Testing - Demonstration
- Child Accomplishment: Access to Advanced Packaging and Testing - Demonstration
- Child Accomplishment: Microelectronics Ecosystem
- Child Cost Item: 6d61a5a94afda2baf6fb8d9d02352016
- Child Project: Address DoD Unique Needs Radiation Hardening and non-CMOS - Demonstration
- Child Accomplishment: Address DoD Unique Needs - Radiation Hardening and non-CMOS - Demonstration
- Child Accomplishment: Microelectronics Ecosystem
- Child Cost Item: c26c896f2d85c2a39013b63d4be887b2