Access to Advanced Packaging and Testing - Demonstration
Abstract
This project will leverage existing commercially available expertise and capability to deliver self-sustaining digital and radio frequency (RF) state-of-the-art (SOTA) heterogeneous integrated packaging (SHIP), assembly, and test capability.
Document Details
- Document Type
- Project
- Publication Date
- Oct 01, 2023
- Source ID
- 903_0605294D8Z_5_0400_PB_2023
Related Documents
- Root: Trusted and Assured Microelectronics
- Child Accomplishment: Access to Advanced Packaging and Testing - Demonstration
- Child Accomplishment: Microelectronics Ecosystem
- Child Cost Item: 6d61a5a94afda2baf6fb8d9d02352016