Access to Advanced Packaging and Testing - Demonstration

Abstract

This project will deliver an on-shore SHIP assembly and test capability. It will provide access to, personalization of, and customization for supporting the DoD programs. It will enable a revolutionary leap in system performance that will greatly reduce size, weight and power (SWaP) by incorporating the immense advances in SOTA commercial off the shelf (COTS) processing technologies, such as field programmable gate arrays (FPGAs), microprocessors, and Graphic Processing Units (GPUs).

Document Details

Document Type
Accomplishment
Publication Date
Oct 01, 2023
Source ID
e09dc7f175ddfedafdd53390a5cce72d

Tags

Readers

  • Integrated Circuit Design and Technology.
  • Military Science and Technology Research and Modernization.
  • Parallel and Distributed Computing.

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