Cryogenic Adhesive Evaluation Study

Abstract

Five classes of adhesives were selected for evaluation at cryogenic temperatures on the basis of reported promising high lap-shear strengths at -65 degrees F and 75 degrees F. Lap-shear specimens were tested at -423 degrees F, -320 degrees F, -100 degrees F, and 75 degrees F utilizing epoxy-nylon adhesives, nitrile-phenolic adhesives, epoxy-polyamide adhesives, an epoxy-phenolic adhesive, and a polyurethane adhesive. Selection of adherents for testing was based on the anticipated use of these materials in future missiles and spacecraft, the prevalent use of some of these materials in the Atlas and Centaur, and the promising cryogenic properties of the base material.

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Document Details

Document Type
Technical Report
Publication Date
Jan 25, 1961
Accession Number
AD0273219

Entities

People

  • J. Hertz

Organizations

  • General Dynamics

Tags

Communities of Interest

  • Weapons Technologies

DTIC Thesaurus Topics

  • Adhesives
  • Elastic Properties
  • Films
  • Laminated Plastics
  • Laminates
  • Material Degradation Processes
  • Materials
  • Materials Laboratories
  • Materials Testing
  • Mechanical Properties
  • Modulus Of Elasticity
  • Plastics
  • Polyurethanes
  • Resins
  • Shear Strength
  • Spacecraft
  • Stainless Steel

Readers

  • Aerospace Test and Evaluation
  • Surface Coatings Technology.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Space