DEVELOPMENT OF A LONG LIFE O-RING COMPOUND FOR USE IN AIRCRAFT HYDRAULIC SYSTEMS USING MIL-H-5606 FLUIDS AT PRESSURES UP TO 3000 PSI AND TEMPERATURES RANGING FROM -65 F TO +275 F

Abstract

This report describes the program for the development of a long life O-ring compound for use in aircraft hydraulic systems using MIL-H-5606 fluids at pressures up to 3000 psi and temperatures ranging from -65 F to +275 F. Compounding and blending efforts conducted during the program explored fluoroelastomers, polyacrylates, butadiene-acrylonitrile copolymers, epichlorohydrin elastomers, propylene-oxide rubber, polyurethane elastomers, chlorosulfonated polyethylenes, silicons, and others. Static and dynamic O-ring evaluations conducted on MIL-P-25732 buna N compounds confirmed contentions that this compound has limited heat resistance at 275 F, especially when it experiences some exposure to air. The same tests conducted on MIL-R-25897 fluoroelastomer compounds have shown that they have poor compression set characteristics, low temperature limitations, and poor extrusion resistance. Two compounds developed during the program exhibited performance superior to the aforementioned Military Specification compounds when evaluated in static and dynamic O-ring tests. The first of these compounds utilized Hydrin 200, a copolymer of epichlorohydrin with ethylene oxide; the other was an ECD-487 low temperature Viton) compound.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1966
Accession Number
AD0485022

Entities

People

  • Paul F. Nenninger

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Alkenes
  • Biomedical And Dental Materials
  • Butadienes
  • Chemistry
  • Copolymers
  • Hydraulic Fluids
  • Long Life
  • Low Temperature
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Testing
  • Performance Tests
  • Physical Properties
  • Resistance
  • Standards
  • Test And Evaluation

Readers

  • Polymer Science and Engineering.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems