R&D OF THE TECHNOLOGIES REQUIRED TO DESIGN AND FABRICATE ULTRAHIGH-SPEED COMPUTER SYSTEMS

Abstract

A research and development program directed toward the development of high speed computer subsystem fabrication technologies is described and the results of device yield and speed-power dissipation improvements are reported. Small geometry, shallow diffused, npn silicon transistors are utilized in simple ECL circuit forms to achieve high performance at low power dissipation in complex array structures. Various component interconnection technologies are being developed and characterized for high density, high speed subsystems. Multilevel single chip and multichip assemblies are being investigated. Reliability studies of functioning arrays have been initiated.

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1968
Accession Number
AD0670855

Entities

Organizations

  • Massachusetts Institute of Technology

Tags

DTIC Thesaurus Topics

  • Assembly
  • Circuits
  • Computers
  • Content Addressable Memory
  • Fabrication
  • Failure Analysis
  • Failure Mode And Effect Analysis
  • Geometry
  • Large Scale Integration
  • Microcircuits
  • Microelectronics
  • Printed Circuits
  • Resistance
  • Schematic Diagrams
  • Test And Evaluation
  • Test Methods
  • Transistors

Readers

  • Integrated Circuit Design and Technology.