Stress Analysis of an Adhesive Lap Joint Subjected to Tension, Shear Force and Bending Moments

Abstract

A stress analysis of the lap joint is presented treating the problem as one of plane strain. The joint is subjected to a general loading, consisting of tension, shear force and bending moments. The variation in the material properties and thickness of the two adherends is considered. The displacement field in the adhesive layer is expressed in series form and the compatibility condition at the interface is used to express the displacement field in the adherends. The potential energy of the joint is calculated and minimized to obtain linear, ordinary differential equations and boundary conditions. The differential equations are solved on the computer. Photoelasticity is used to confirm the theory. Two specimens of lap joint using a 1/4 in. layer of a photoelastic plastic simulating the adhesive, are tested photoelastically. The agreement between the theoretical and the experimental results is found to be good. Design recommendations for the lap joint are made based on the results of this investigation.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1972
Accession Number
AD0753469

Entities

People

  • Murlidhar H. Pahoja

Organizations

  • University of Illinois Urbana–Champaign

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Adhesives
  • Bending Moments
  • Composite Materials
  • Computer Programming
  • Computer Programs
  • Computers
  • Differential Equations
  • Elastic Properties
  • Mechanical Properties
  • Mechanics
  • Modulus Of Elasticity
  • Shear Modulus
  • Shear Stresses
  • Stress Analysis
  • Stress Concentration
  • Stress Strain Relations
  • Stresses

Fields of Study

  • Engineering

Readers

  • Calculus or Mathematical Analysis
  • Mechanical Engineering/Mechanics of Materials.
  • Surface Coatings Technology.