Investigation of Heat Removal From Both Sides of a Transistor Chip Embodying Bump Technology
Abstract
The purpose of the work was to determine the feasibility of removing heat simultaneously from both the collector and emitter sides of a double diffused transistor chip. The work consisted of forming a large silver bump over the emitter and a small bump for base contact on the front side of a power transistor chip. This chip was mounted face down on a modified TO-60 header and a large silver strap was used to contact the collector on the back side. A non-multiple emitter structure mounted as above showed a 40% decrease in thermal resistance over a chip mounted face up in a standard manner.
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 01, 1968
- Accession Number
- AD0840289
Entities
People
- H. F. Rueffer
Organizations
- Hughes Aircraft Company