Pyroelectric/Integrated Circuit Infrared Imaging Array Development
Abstract
Progress made toward the development of pyroelectric/integrated circuit thermal imaging area arrays and their associated address and sense circuits is described. The processing techniques and steps required to form two- dimensional arrays of thin film triglycine sulfate detectors on field-effect integrated circuit substrates are reviewed. The approach to providing the required high degree of thermal isolation between the polycrystalline detectors and the silicon portion of the circuit is to etch away the silicon underlying the detectors. A second pyroelectric imaging array consisting of a thin permanently poled single crystal section of TGS positioned above the integrated circuit substrate is also described. In this arrangement the resulting air gap provides the thermal isolation and contacts to the array detectors are made by means of vacuum deposited microfinger springs. The relative merits of X-Y addressed versus bucket brigade pyroelectric arrays are discussed. An analysis of the performance capabilities of an X-Y addressed polycrystalline TGS array indicates that a system noise equivalent temperature difference of 0.42C at 10 frames/second should be achievable in an array consisting of 10-micrometer thick detectors 4 mils on a side and spaced on 8-mil centers.
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1972
- Accession Number
- AD0908292
Entities
People
- A. Boornard
- David L. Hall
- E. Herrmann
- P. D. Southgate
- R. D. Larrabee