Thin Film Thermoelectric Metal-Organic Framework with High Seebeck Coefficient and Low Thermal Conductivity. Supporting Information

Abstract

A new thermoelectric material with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal-organic framework (MOF) using the guest at MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Apr 28, 2015
Accession Number
AD1010198

Entities

People

  • A. A. Talin
  • Brian M. Foley
  • Catalin D. Spataru
  • François Léonard
  • Kristopher J. Erickson
  • Mark D. Allendorf
  • Michael E. Foster
  • Patrick E Hopkins
  • Reese E. Jones
  • Vitalie Stavila

Organizations

  • University of Virginia

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms

DTIC Thesaurus Topics

  • Advanced Materials
  • Conductivity
  • Films
  • Frequency
  • Heat Capacity
  • Heat Flux
  • Materials
  • Measurement
  • Molecular Dynamics
  • Repetition Rate
  • Sensitivity
  • Surface Temperature
  • Thermal Conductivity
  • Thermophysical Properties
  • Thin Films

Fields of Study

  • Materials science

Readers

  • Nanocomposite Materials Science
  • Thermal Physics or Thermal Science.