Thermal Isolation and Differential Cooling of Heterogeneously Integrated Devices

Abstract

The challenges of thermally isolating heterogeneously integrated components from one another was investigated. This work introduces the concept of microspreading resistance as a component of the thermal behavior of arrays of conductive vias. Recommendations for mitigating microspreading when it is undesirable is provided, and a formalism for incorporating it into existing equivalent thermal conductivity models of via arrays. After examining several heterogeneous integration approaches, it was determined that a segregated chiplet approach offered the most promising avenue for thermal isolation efforts.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 2016
Accession Number
AD1011632

Entities

People

  • Patrick Mccluskey

Organizations

  • University of Maryland

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Air Force Research Laboratories
  • Complementary Metal-Oxide Semiconductors
  • Composite Materials
  • Electronics Industry
  • Electronics Laboratories
  • Fabrication
  • Finite Element Analysis
  • Heat Transfer
  • Heat Transfer Coefficients
  • Heterojunction Bipolar Transistors
  • Materials
  • Measurement
  • Reliability
  • Resistance
  • Semiconductors
  • Thermal Conductivity

Readers

  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design
  • Thermal Physics or Thermal Science.