Advances in Flexible Hybrid Electronics Reliability

Abstract

Flexible Hybrid Electronics combine the best characteristics of printed electronics and silicon ICs to create high performance, ultra-thin, physically flexible systems. Tests and methods are being developed to evaluate the reliability of these systems. Initial results are presented for flexible hybrid electronics systems.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Mar 01, 2017
Accession Number
AD1042235

Entities

People

  • Brian N. Meek
  • Dale G. Wilson
  • Darrell E. Leber
  • Douglas R Hackler
  • Kelly J. Degregorio
  • Richard L. Chaney
  • Seth D. Leija
  • Steven F. Wald

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force Research Laboratories
  • Curvature
  • Delamination
  • Electron Microscopes
  • Electronics
  • Electronics Industry
  • Failure Mode And Effect Analysis
  • Inspection
  • Manufacturing
  • Materials
  • Model Tests
  • Scanning Electron Microscopes
  • Semiconductors
  • Standards
  • Stress Tests
  • Substrates
  • Test Methods

Fields of Study

  • Physics

Readers

  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics