RT 184: Electronic Survivability in Harsh Environments

Abstract

Determination of the fracture parameters such as fracture toughness and strain energy release rate under out-of-plane deformation. Effect of process parameters such as cure schedule and temperature on fracture toughness and characterize the mechanics of interface delamination of potting-PCB interface. Create modeling framework for delamination prediction.

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Document Details

Document Type
Technical Report
Publication Date
Sep 30, 2018
Accession Number
AD1063071

Entities

People

  • Pradeep Lall

Organizations

  • Auburn University

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms

DTIC Thesaurus Topics

  • Assembly
  • Composite Materials
  • Delamination
  • Electrical Properties
  • Electronic Components
  • Electronics
  • Encapsulation
  • Environment
  • Epoxy Resins
  • Extreme Environments
  • Failure Mode And Effect Analysis
  • High Temperature
  • Human Body
  • Manufacturing
  • Materials
  • Materials Science
  • Mechanics
  • Reliability
  • Resins
  • Shelf Life
  • Systems Engineering
  • Toughness
  • X Rays
  • X-Ray Computed Tomography

Readers

  • Metallurgy
  • Structural Dynamics.
  • Surface Coatings Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene