FlexTrate A Biocompatible Flexible Electronics Platform for High Performance Applications using Fan-Out Wafer-level Packaging

Abstract

A novel mechanically flexible platform based on fan-out wafer-level packaging (FOWLP) is demonstrated. FlexTrate enables heterogeneous integration of high performance dies in a flexible and biocompatible elastomeric package. We demonstrate two applications: 1) a foldable seven segment display that is bendable to 1 mm radius for more than 1000 cycles, and 2) a near field wireless implantable optogenetic system that is bendable to 5mm bending radius.

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Document Details

Document Type
Technical Report
Publication Date
Mar 25, 2019
Accession Number
AD1075349

Entities

People

  • Amir Hanna
  • Arsalan Alam
  • Goutham Ezhilarasu
  • Subramanian Iyer
  • Takafumi Fukushima

Organizations

  • University of California

Tags

Communities of Interest

  • Advanced Electronics
  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Adhesives
  • Assembly
  • Computer Programming
  • Computers
  • Couplings
  • Electronics
  • Electroplating
  • Engineering
  • Flexible Electronics
  • Glass Transition Temperature
  • Images
  • Integrated Systems
  • Load Monitoring
  • Optical Images
  • Packaging
  • Schottky Diodes
  • Transition Temperature

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Military Engineering.
  • Nanocomposite Materials Science

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems