A Rapid Microelectronics Packaging Platform Implementing Self-Shielded Interconnects
Abstract
Miniature Multi-wire Systems (MMS) is an emerging rapid packaging platform for complex microelectronic systems. Packaging time is minimized by creating all interconnects using bond wires and micron-sized coaxial cables (MCCs). Design cycle time is greatly reduced by installing shield bond wires for high frequency interconnects, preventing electromagnetic interference. The MCCs are typically partitioned into two classes, one for signal distribution with characteristic impedances between 30-70 ohms, and one for power distribution with impedances less than 10 ohms. We have developed methods to fabricate, strip and bond MCCs with outer diameters between 25-100 microns. Crosstalk measurements show at least 20 dB greater isolation for MCCs than bare bond wires. Customized hardware and software algorithms compatible with a conventional wire bonder enable automated interconnect design and routing capabilities for modules with hundreds of interconnects. The software incorporates geometric and electrical design targets for the MMS platform and outputs a full interconnect placement order with geometric data for 3-dimensional routing geometries.
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 25, 2019
- Accession Number
- AD1075557
Entities
People
- Amy Duwel
- Caprice Gray
- Daniela A. Torres
- Jeffery B. Delisio
- John Lachapelle
- Mitchell Meinhold
Organizations
- Charles Stark Draper Laboratory