3D Heterogeneous Integration of Microwave/Millimeter Wave Sensor and Communications Microsystems Using High Aspect Ratio Micromachined "Building Block" Technology

Abstract

This project focused on the development of 3D heterogeneous integration strategies for RF/microwave/millimeter wave Microsystems. Three thrust areas were explored. The first thrust area was the development of a 3D heterogeneous integration process based on the mechanical fit of high-aspect-ratio micromachined structures. In this effort, prefabricated power amplifier RFICs or MMICs were mated to a coplanar-waveguide carrier substrate through micromachined vertical interconnects realized in a high-aspect-ratio SU-8 process.

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Document Details

Document Type
Technical Report
Publication Date
Jul 08, 2020
Accession Number
AD1109831

Entities

People

  • Sanjay Raman

Organizations

  • Virginia Tech

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • 5G Wireless Networks
  • Amplifiers
  • Antenna Arrays
  • Aspect Ratio
  • Compound Semiconductors
  • Detectors
  • Fabrication
  • Flip Chips
  • Integrated Circuits
  • Liquid Metals
  • Metal Contacts
  • Millimeter Waves
  • Monolithic Microwave Integrated Circuits
  • Power Amplifiers
  • Semiconductors
  • Three Dimensional
  • Transmission Lines

Readers

  • Integrated Circuit Design and Technology.
  • Nanofabrication and Microfabrication.

Technology Areas

  • 5G