Tin as a Shock-Melting Binder for Reactive Materials

Abstract

Reactive material warhead cases have the potential to greatly increase ordnance lethality by the addition of metal combustion, to explosive and fragmentation effects. Efficient combustion of the reactive metal relies on adequate dispersion of fine metal debris following detonation or impact. This thesis examines the use of tin as a soft binder for cold-isostatically pressed aluminum powder. The tin can potentially shock melt under rapid loading, increasing the dispersion of the aluminum by dynamically creating liquid failure regions. Several mechanical tests, including Split-Hopkinson Pressure Bar compression and Brazilian tension tests, gas gun impact tests, and three-point bend tests, as well as scanning electron microscopy, were used to determine dynamic strength, fragmentation properties, fracture toughness, and other mechanical properties of aluminum-tin composites of varying composition. Samples with lower tin content (510% by volume) were highly homogeneous and had low porosity following annealing. However, from a structural standpoint the tin binder results in reductions in strength and toughness compared to a pure pressed-aluminum powder compact. Analysis of the microstructure shows that tin acts as a soft buffer, weakening mechanical properties by preventing interlocking of the aluminum particles during the compaction. The final optimized composite may be useful for enhanced blast thermobaric cases that favor metal dispersion over structural strength.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 2020
Accession Number
AD1114553

Entities

People

  • Owen S. Esposito

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Composite Materials
  • Electron Microscopes
  • Electron Microscopy
  • Explosives
  • Failure Mode And Effect Analysis
  • Heat Treatment
  • Materials
  • Materials Testing
  • Mechanical Properties
  • Mechanics
  • Microscopes
  • Microscopy
  • Particle Size
  • Physical Properties
  • Scanning Electron Microscopes
  • Scanning Electron Microscopy
  • Test Methods

Fields of Study

  • Materials science

Readers

  • Explosive Engineering.
  • Mechanical Engineering/Mechanics of Materials.
  • Surface Engineering/Surface Coating Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene