Assessment of Data Center Liquid Cool for Energy Savings

Abstract

Data centers are the most energy-intensive DoD buildings. They consume more than 10% of all DoD electricity (40% for cooling) and produce 7.5 tril. BTUs/year of unused heat. Direct-to-chip liquid cooling is a unique data center efficiency technology that brings high-performance liquid-cooling directly to the hottest elements inside each server (hot-spot cooling), with the potential to cut cooling energy by 60-80%, and to allow for reused of the heat as on-site energy. It can also enable 2.5x data center consolidation with no additional infrastructure costs. The need for liquid cooling is being driven by several factors, including the increased demand for greater power density, coupled with higher IT performance for HPC and some hyper-scale computing, and the overall industry focus on energy efficiency. The purpose of the demonstration is to document performance of the equipment about energy savings, reliability, and life cycle cost that can be achieved in the real-world environment of a DoD data center. The data and insights gained in the demonstration has been used to create awareness and acceptance of the technology to facilitate future technology transfer across all DoD data centers.

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Document Details

Document Type
Technical Report
Publication Date
Nov 20, 2019
Accession Number
AD1135067

Entities

People

  • James Elsworth
  • Otto Vangeet
  • Steve Branton

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Conditioning
  • Air Cooled
  • Central Processing Units
  • Cooling
  • Cooling Towers
  • Cost Analysis
  • Data Centers
  • Department Of Defense
  • Electricity
  • Energy
  • Energy Efficiency
  • Flow Rate
  • Graphics Processing Unit
  • Greenhouse Effect
  • High Performance Computing
  • Liquid Cooling
  • Standards

Fields of Study

  • Engineering

Readers

  • Defense Technology Research and Development.
  • Energy Conservation and Renewable Energy Engineering.
  • Thermal Physics or Thermal Science.