A Study on Printed Circuit Board Backdoor Coupling and Stackup Considerations

Abstract

Objective: Pursuing a better understanding the following: Which design parameters affect PCB coupling, how much can a given parameter reduce coupling, under what conditions does a given parameter reduce coupling, better understanding enables informed HPM hardening techniques.

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Document Details

Document Type
Technical Report
Publication Date
Mar 22, 2021
Accession Number
AD1136532

Entities

People

  • Elizabeth Reiner
  • Jin-woo Choi
  • Ryan Tortorich
  • William Bouillon
  • William Morell

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Acoustic Absorption
  • Anechoic Chambers
  • Angle Of Incidence
  • Boundaries
  • Circuit Boards
  • Circuits
  • Couplings
  • Current Density
  • Electronics
  • Finite Element Analysis
  • Frequency
  • Frequency Domain
  • High Density
  • Literature
  • Machine Learning
  • Printed Circuit Boards
  • Printed Circuits
  • Simulations
  • Simulators

Readers

  • Optical Fiber Sensing and Electromagnetic Propagation.
  • Software Engineering
  • Systems Analysis and Design