Standard Operating Procedure for On-Chip Porous Silicon Surface Functionalization
Abstract
A standard operating procedure for a Schlenk line, degassing solvents by the freeze-pump-thaw method, and porous silicon (pSi) functionalization is detailed. On-chip pSi devices were prepared by anodic etching in 3:1 hydrofluoric acid: ethanol (v/v) solution and subsequently functionalized with 1-octene by thermal hydrosilylation. The chips demonstrated good protection from ambient air moisture.
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 01, 2022
- Accession Number
- AD1179153
Entities
People
- Nathan A. Banek
- Wayne A. Churaman
Organizations
- United States Army Research Laboratory