Solder Paste Reflow Study

Abstract

This document details the method and results obtained from a study of the volumetric properties of solder paste used in the surface mount assembly of electronic components on a Printed Circuit Board (PCB). Of particular interest is the volume reduction that results from the reflow process in a convection reflow oven used in assembly of a PCB.

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Document Details

Document Type
Technical Report
Publication Date
Apr 21, 2023
Accession Number
AD1206397

Entities

People

  • Stephen Redington

Organizations

  • Picatinny Arsenal

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Accuracy
  • Aluminum
  • Assembly
  • Circuit Boards
  • Diameters
  • Efficiency
  • Electronic Components
  • End Mill
  • Errors
  • Experimental Data
  • Geometry
  • Measurement
  • Printed Circuit Boards
  • Printed Circuits

Readers

  • Integrated Circuit Design and Technology.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems