Hybrid Microelectronics Process and Quality Control Guide

Abstract

This book has been written for the following purposes: (1) To identify critical processes and establish process controls and quality control data, which, if properly implemented may serve to replace some of the screens which are routinely performed after the hybrid assembly process, (2) To aid military procurement agencies to evaluate prospective hybrid vendors, (3) To aid hybrid vendors to evaluate their own processes, (4) To aid new vendors in establishing proper process controls and quality criteria, and (5) To serve as a general information and reference source. It should be noted that this book is a guide and not a specification. The information contained in it is recommended only, even though such words as 'mandatory' are used. In no case is it intended that the data listed be used as requirements to be imposed on a prospective vendor.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1976
Accession Number
ADA030422

Entities

People

  • James M. Montante
  • Rudolph G. Oswald
  • William R. De Miranda

Organizations

  • Honeywell International, Inc.

Tags

DTIC Thesaurus Topics

  • Beam Leads
  • Dielectric Permittivity
  • Fabrication
  • Finishes
  • High Temperature
  • Materials
  • Measurement
  • Microelectronics
  • Power Supplies
  • Production
  • Pull Tests
  • Shear Tests
  • Shock Tests
  • Standards
  • Thick Films
  • Thin Films
  • Visual Inspection

Readers

  • Logistics and Supply Chain Management.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems