High-Reliability, Low-Cost Integrated Circuits.
Abstract
Wafer fabrication for the CA741, 5420, 54S20, 5470, 5472, CD4012B, CD4027B, and CD4014A has been initiated. Lead wafers for most of the circuits are in the metallization process. The required array of life-test sockets for each type has been ordered, and samples of CD4012B and CA741 are being assembled for accelerated life test and step-stress testing. Initial reliability data obtained on CA741 devices indicate that the contract goal of less than 0.005% failures per 1000 hours at 125 C operating life is attainable. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- May 01, 1977
- Accession Number
- ADA041778