Development of Technologies and Procedures for Advanced Microcircuit Prototype Fabrication.

Abstract

This report investigates the problems involved in implementing integrated circuits. Its six separate parts address hybrid integration, computer-aided thermal modeling, thermal simulation, thermal analysis and measurement, thick film resistor noise, noise in optical isolators, automated conductor routing, computer aided design, thin-film microcircuits on flexible substrates, and logic simulation. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1978
Accession Number
ADA058613

Entities

People

  • B. D. Carroll
  • D. V. Kerns
  • K. B. Cook Jr.
  • T. D. Slagh

Organizations

  • Auburn University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Bipolar Junction Transistors
  • Circuit Boards
  • Crystal Structure
  • Electrical Engineering
  • Electronics Laboratories
  • Film Resistors
  • Geometry
  • Integrated Circuits
  • Materials
  • Measurement
  • Modules (Electronics)
  • Plastic Explosives
  • Semiconductor Devices
  • Semiconductors
  • Simulators
  • Thermal Conductivity
  • Three Dimensional

Fields of Study

  • Physics

Readers

  • Acoustics.
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics