Modular Avionics Packaging (MAP).

Abstract

In considering Modular Avionics Packaging, the objective of the General Electric study program was to develop an avionics equipment packaging concept, compatible with MIL-E-5400, and applicable to multiplatform avionics requirements stretching into the 1990's. Specific elements evaluated were: Standard Avionics Module (SAM) requirements and concepts; integrated racks and WRA requirements and concepts; and airframe interface considerations. The V/STOL Type A platform was used as the driving requirement in performing trade-off studies. Key design objectives and constraints included the following: Minimizing installed avionics weight and volume; Mechanical simplicity; Significant improvement in Reliability and Maintainability; Eliminating single-point failure modes; Direct access to Weapons Replaceable Modules (WRM); Modules capable of being conduction-cooled; Significant improvement in thermal performance; and Improved testability at all hardware levels.

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Document Details

Document Type
Technical Report
Publication Date
Nov 30, 1977
Accession Number
ADA059637

Entities

Organizations

  • General Electric

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies
  • Engineered Resilient Systems
  • Ground and Sea Platforms
  • Weapons Technologies

DTIC Thesaurus Topics

  • Aircrafts
  • Airframes
  • Circuit Boards
  • Composite Materials
  • Engineers
  • Failure Mode And Effect Analysis
  • Heat Transfer
  • Instruction Set Architecture
  • Integrated Circuits
  • Material Degradation Processes
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Resonant Frequency
  • Semiconductors
  • Test And Evaluation

Fields of Study

  • Engineering

Readers

  • Electrical Engineering
  • Software Engineering