Hybrid Packaging of Integrated Circuits for Engine Controls.

Abstract

This report documents the design, test, and development of an advanced electronic packaging candidate for future, on-engine electronic controls. Materials with low and well-matched expansion properties, special processes, and special joining alloys were used because of the large number of thermal cycles expected. Tape-automated bonding was used because it offers improved reliability and lower production cost. Included in the program were temperature cycling, thermal shock, vibration bench testing, and on-engine environmental testing. The results obtained were favorable. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1978
Accession Number
ADA062125

Entities

People

  • Howard B. Kast
  • James A. Loughran

Organizations

  • General Electric

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Aluminum Oxides
  • Circuit Boards
  • Dielectric Properties
  • Dielectrics
  • Electronic Components
  • Fabrication
  • Heat Transfer
  • Integrated Circuits
  • Manufacturing
  • Material Degradation Processes
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Semiconductor Devices
  • Semiconductors
  • Test And Evaluation

Readers

  • Aerospace Engineering
  • Integrated Circuit Design and Technology.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems