Development Report for High-Reliability, Low-Cost Integrated Circuits.

Abstract

Wafer fabrication has been completed. The control units (aluminum metallized DIC and DIP devices and trimetal devices in open DIC packages) are 90-percent complete. Thermal-shock testing of HRLC (high-reliability, low-cost) product has defined a beam-tape design problem which has necessitated the redesign of the beam tapes on all types. Life-test matrices have been run on CD4012 and CA741 to gain a preliminary insight into the failure modes to be expected in Phase III. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Sep 03, 1978
Accession Number
ADA062706

Tags

DTIC Thesaurus Topics

  • Aluminum
  • Ceramic Materials
  • Electronics
  • Engineering
  • Fabrication
  • Failure Mode And Effect Analysis
  • Heat Of Activation
  • High Reliability
  • Indicators
  • Integrated Circuits
  • Life Tests
  • Materials
  • Resistance
  • Semiconductors
  • Shock
  • Specifications
  • Thermal Shock

Readers

  • Aerospace Test and Evaluation
  • Integrated Circuit Design and Technology.
  • Surface Engineering/Surface Coating Technology.