Manufacturing Methods and Technology Engineering for Tape Chip Carrier.

Abstract

This report describes the work performed during the fourth quarter of a 26-month contract. The contract is aimed at establishing and demonstrating the feasibility of an automated assembly line for hybrid microcircuits using tape chip carrier technology for semiconductor devices whenever practical. The automated line will also make use of automatic substrate handling equipment to move partially assembled devices in and out of magazines. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1979
Accession Number
ADA065890

Entities

People

  • William R. Rodrigues De Miranda

Organizations

  • Honeywell International, Inc.

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Weapons Technologies

DTIC Thesaurus Topics

  • Acceptance Tests
  • Air Force
  • Assembly
  • Assembly Lines
  • Crystal Oscillators
  • Electronic Commutators
  • Electronics
  • Engineering
  • Fabrication
  • Generators
  • Manufacturing
  • Materials
  • Military Research
  • Oscillators
  • Power Supplies
  • Semiconductors
  • Signal Generators

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Software Engineering

Technology Areas

  • Microelectronics