Infrared Inspection of Printed Circuits.
Abstract
A system has been demonstrated to have the capability to identify and isolate printed circuit wiring board flaws which are presently undetected by existing means. The demonstration system uses an infrared sensor and a scanner to read the thermal characteristics of an operating printed wiring board. The thermal measurements are digitized and computer processed to compare the board's thermal map with a prerecorded standard. The fault location coordinates are read out by the computer. The system is applicable to a production test environment where multiple test stations can be accommodated by the data processor. The selection of the appropriate sensors, scanner, data processor, and test algorithms have been optimized toward maximum sensitivity to fault detection, measurement repeatability, and cost effectiveness. Trade-offs of these parameters are discussed. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 15, 1978
- Accession Number
- ADA068140
Entities
People
- Gordon D. Little
- L. C. Layfield
- V. W. Ruwe
- W. Tomme