LSI/Microprocessor Reliability Prediction Model Development.

Abstract

This report presents updated reliabilty prediction models for LSI, microprocessor and memory devices for inclusion in MIL-HDBK-217B, 'Reliability Prediction of Electronic Equipment'. The models proposed in this study possess all those qualities common to practical reliability assessment techniques. The expressions are relatively simple and allow for consideration of evolving fabrication techniques, or emerging technologies, through the modification of temperature dependency and associated temperature factors. The factors exhibit the appropriate discriminations against the device design and usage attributes which contribute to known failure mechanisms. Additionally, each of the models demonstrate reasonable accuracy over the total range of parameters considered in these techniques. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1979
Accession Number
ADA068911

Entities

People

  • H. C. Rickers

Organizations

  • IIT Research Institute

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Circuit Boards
  • Computer Programming
  • Computers
  • Data Analysis
  • Data Sets
  • Databases
  • Electronic Equipment
  • Fabrication
  • Failure Mode And Effect Analysis
  • Instruction Set Architecture
  • Integrated Circuits
  • Large Scale Integration
  • Literature Surveys
  • Memory Devices
  • Regression Analysis
  • Reliability
  • Statistical Analysis

Fields of Study

  • Engineering

Readers

  • Inertial Navigation Systems.
  • Integrated Circuit Design and Technology.
  • Theoretical Analysis.

Technology Areas

  • Microelectronics