Deleterious Effect of Fusing Fluids on Printed Wiring Boards.

Abstract

This study identified the corrosive effects of fusing fluids and fusing fluid residues on printed wiring boards subjected to electrical stress in a humid environment at elevated temperature. The effect of varying delay times between solder fusing and cleaning of fusing fluid residues for three fusing fluids was studied. The effect of a single delay time between solder fusing and cleaning of fusing fluid residues for eight other fusing fluids was studied. Also, the protective value of a solder resist and a conformal coating was evaluated. (Author)

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Document Details

Document Type
Technical Report
Publication Date
May 09, 1979
Accession Number
ADA072716

Entities

People

  • David O. Pond

Organizations

  • Naval Air Warfare Center, Indianapolis

Tags

DTIC Thesaurus Topics

  • Air Force
  • Air Force Facilities
  • Analysis Of Variance
  • Circuit Boards
  • Electronic Equipment
  • Engineering
  • Engineers
  • Environment
  • Environmental Pollutants
  • Flow
  • Heat Transfer
  • High Temperature
  • Materials
  • Materials Engineering
  • Materials Laboratories
  • Plastic Explosives
  • Resistance

Readers

  • Electrical Engineering
  • Petroleum Engineering
  • Surface Coatings Technology.