Photolithographic Techniques for Surface Acoustic Wave (SAW) Devices. Volume 4. Technical and Operational Parts 4, 5.
Abstract
The object of the program was the establishment of a production capability for surface acoustic wave devices of varied design and material for the purpose of meeting estimated military needs and to establish a base and plans which may be used to meet expanded requirements. The primary requirement was the pilot line production of devices that are reliable, reproducible, and low cost. Phase III involved fabrication of a large quantity of confirmatory devices which were sampled at a high rate and subjected to rigorous life and environmental testing. Phase III was successfully completed with delivery and acceptance of the confirmatory samples. The device configuration is detailed as it existed for Phase III along with assembly details, results and conclusions from the Confirmatory Sample production run. The Fourth Engineering Phase (Phase IV) of the program was pilot line production effort of 150 each of the devices scheduled to be delivered. Solder sealing was identified as a problem area during Phase IV for SAW devices in semiconductor pin packages. New solder seal screening and processing procedures were investigated. In addition, alternative sealing approaches were evaluated. These procedures, Tungsten Inert Gas (TIG) and projection and seam welding were demonstrated to be more compatible with SAW processing. They are especially suitable for high volume production.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 01, 1978
- Accession Number
- ADA081126
Entities
People
- A. W. Dozier
Organizations
- Hughes Aircraft Company