Autoclave Testing of Plastic Encapsulated 4001 CMOS Integrated Circuits.

Abstract

Samples from 10 vendors of CMOS 4001 plastic encapsulated integrated circuits were tested in an autoclave at 121 C, 100% RH and 15 psig with and without electrical bias. Twenty-nine test groups of 16 circuits each accumulated over 200,000 device hours. Failure analyses were performed to verify moisture related electrochemical aluminum metal corrosion on the die. Weibull failure distributions showed large differences in moisture resistance reliability among the various vendor products. Test devices with newer data coded packages had longer median life times. There was no correlation of median life time between groups with and without electrical bias. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1980
Accession Number
ADA081555

Entities

People

  • Richard Holecinski

Organizations

  • United States Army Communications-Electronics Command

Tags

DTIC Thesaurus Topics

  • Aluminum
  • Autoclaves
  • Circuit Boards
  • Complementary Metal-Oxide Semiconductors
  • Corrosion
  • Electrical Circuits
  • Electronics
  • Failure Analysis
  • Failure Mode And Effect Analysis
  • Integrated Circuits
  • Metals
  • Moisture
  • Moistureproofing
  • Packaged Circuits
  • Printed Circuits
  • Semiconductor Devices
  • Semiconductors

Readers

  • Integrated Circuit Design and Technology.
  • Mathematics or Statistics
  • Reinforced Composite Materials