Integrated Rack Concept Study for V/STOL Type Aircraft.

Abstract

Six different rack concepts were investigated for determining the most optimum configuration of packaging the avionic equipment on A and B type V/STOL aircraft. The two basic approaches of cooling the rack considered were air impingement and conduction cooled. As a baseline, two module configurations were used; an Improved Standard Electronic Module-2A, and Hollow Core Design with an ISEM-2A form factor. The modules, utilizing chip carrier semiconductor devices, were assumed to dissipate 5 to 10 watts. The rack power system makes use of Solid State Electric Logic (SOSTEL) power management elements. A parametric thermal analysis with junction temperatures from 60 to 125 C was performed. Each of the following disciplines, Mechanical, EMI, ECS, Reliability, Maintainability and Life Cycle Costs were also considered in the design of the racks. A Sensitivity Evaluation Program was used to select the most viable approaches. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1980
Accession Number
ADA081864

Entities

People

  • A. Caserta
  • B. Borgenson
  • E. V. Ramirez
  • R. Dahl
  • V. Cirrito

Organizations

  • Grumman

Tags

Communities of Interest

  • Air Platforms
  • Electronic Warfare
  • Energy and Power Technologies
  • Engineered Resilient Systems
  • Ground and Sea Platforms

DTIC Thesaurus Topics

  • Aircraft Equipment
  • Aircraft Industry
  • Aircrafts
  • Airframes
  • Complementary Metal-Oxide Semiconductors
  • Directed Energy Weapons
  • Electromagnetic Fields
  • Electromagnetic Radiation
  • Electronic Components
  • Heat Exchangers
  • Heat Transfer
  • Resonant Frequency
  • Semiconductor Devices
  • Short Takeoff Aircraft
  • Temperature Gradients
  • Test And Evaluation
  • Test Methods

Readers

  • Combustion and Flow Dynamics.
  • Electrical Engineering
  • Life Cycle Cost Analysis

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems