GaAs Surface Passivation for Device Applications.
Abstract
This report describes the progress in the second six-month period of a program to develop deposited dielectrics for GaAs device applications. Three applications of the dielectrics are being investigated: (1) isolation of control electrodes, (2) passivation of the GaAs surface, and (3) encapsulation of completed circuits. The dielectrics being studied include silicon oxynitride; mixtures of silicon nitride and germanium nitride; and mixtures of silicon dioxide, gallium oxide, and aluminum oxide. During this reporting period, studies of the interface properties of pyrolytically deposited Si3N4 on n-type GaAs under illuminated conditions were performed. The data obtained are consistent with the interpretation that inversion of the GaAs surface is being achieved. In addition, process parameters for plasma-enhanced deposition of silicon nitride films with low oxygen content and refractive index near that of stoichiometric Si3N4 were determined. Evaluation of the interface properties of SiO2 films deposited on GaAs by photochemical deposition is also reported. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 01, 1980
- Accession Number
- ADA096781
Entities
People
- C. L. Anderson
- M. D. Clark
Organizations
- HRL Laboratories