Statistical Analysis of Accelerated Temperature Aging of Semiconductor Devices.
Abstract
Although accelerated temperature stressing of semiconductor devices is an accepted and widely employed technique for assessing the reliability of semiconductor devices, it appears that a statistical error analysis of this procedure is not available. The purpose of this work is to partially remedy this deficiency. The goal of this program is easily stated: A number of devices taken from a distribution are operated at several elevated temperatures to induce failure in all devices within a reasonable time. Assuming general characteristics of the device failure probability density function (pdf) and its temperature-dependence, we estimate the expected cumulative failure function (cff) for devices in normal operation. By estimated cff, we mean our best estimate, based on statistical inference, of the average probability of random device (taken from the same distribution but operated at a normal temperature) failing as a function of time. Section II contains a brief review of the general mathematical formalism usually employed in semiconductor reliability discussions.
Document Details
- Document Type
- Technical Report
- Publication Date
- May 15, 1981
- Accession Number
- ADA099439
Entities
People
- Michael F. Millea
- Walter A. Johnson
Organizations
- The Aerospace Corporation