Computer-Aided Design/Manufacturing (CAD/M) for High-Speed Interconnect.
Abstract
The objective of the Computer-Aided Design/Manufacturing (CAD/M) for High-Speed Interconnect Program study was to assess techniques for design, analysis and fabrication of interconnect structures between high-speed logic ICs that are clocked in the 200 MHz to 5 GHz range. Interconnect structure models were investigated and integrated with existing device models. Design rules for interconnects were developed in terms of parameters that can be installed in software that is used for the design, analysis and fabrication of circuits. To implement these design rules in future software development, algorithms and software development techniques were defined. Major emphasis was on Printed Wiring Board and hybrid level circuits as opposed to monolithic chips. Various packaging schemes were considered, including controlled impedance lines in the 50 to 200 ohms range where needed. The design rules developed are generic in nature, in that various architecture classes and device technologies were considered. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 01, 1981
- Accession Number
- ADA111395
Entities
People
- Norbert F. Santoski