Metal Core Epoxy Glass Circuit Board Evaluation Program.

Abstract

Leadless hermetic chip carriers are becoming the standard IC package. Their use in combination with epoxy glass PWB's results in unreliable solder joints because of the thermal expansion mismatch between the HCC and epoxy glass PWB. The problem is manifested when assemblies are subjected to repeated thermal excursions. This report describes an approach to reducing the CTE of the epoxy glass PWB (15 to 20 ppm/deg C) to a value close to the CTE of the ceramic HCC (6 to 7 ppm/deg C). This is accomplished by laminating a low expansion metal layer internal to the multilayer board. This stabilized MLB reduces the stresses incurred in the solder joints, and subsequently reduces the number of fractures due to solder fatigue when thermally cycled. Test methods, test results and failure analysis are also included in this report. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1981
Accession Number
ADA116040

Entities

People

  • Bruce E. Inpyn

Organizations

  • General Electric

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Assembly
  • Circuit Boards
  • Composite Materials
  • Electronics Industry
  • Fabrication
  • Failure Mode And Effect Analysis
  • Heat Energy
  • Manufacturing
  • Materials
  • Measurement
  • Reliability
  • Standards
  • Stress Tests
  • Temperature Gradients
  • Test And Evaluation
  • Test Methods
  • Thermal Expansion

Readers

  • Electrical Engineering
  • Integrated Circuit Design and Technology.
  • Structural Health Monitoring of Composite Structures.