Fracture & Fatigue Characteristics in Titanium Alloys.

Abstract

The influence of sub-transus solution treatment on room temperature fracture toughness of Ti-6Al-4V (6-4) and Ti-4.5Al-5Mo-1.5Cr (CORONA-5) has been studied as a function of elemental partitioning and volume fraction of alpha and beta phases. Scanning/transmission electron microscopy was used to analyze quantitatively the microstructural components of the two alloys. It was found that, for as-solution treated condition, fracture toughness of 6-4 increased as volume fraction of primary alpha, aluminum content of primary alpha, aluminum content of beta phase, or vanadium content of beta phase decreased. Similarly, for as-solution treated CORONA-5, increases in volume fraction of primary alpha, aluminum and molybdenum contents of primary alpha, or chromium content of beta phase led to a decrease in toughness. In the case of solution-treated and aged 6-4, the analysis indicated that toughness was improved by increasing the vanadium content of the beta phase, increasing the size of secondary alpha plates, reducing the aluminum content of primary alpha, or by reducing the volume fraction of retained beta. Aging CORONA-5 after solution treatment resulted in a very fine secondary alpha structure within transformed beta regions.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1982
Accession Number
ADA117155

Entities

People

  • C. G. Rhodes
  • J. C. Chesnutt
  • M. R. Mitchell

Tags

Communities of Interest

  • Cyber
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Crack Propagation
  • Electron Microscopes
  • Electron Microscopy
  • Heat Treatment
  • Materials
  • Mechanical Properties
  • Mechanical Working
  • Microscopes
  • Microscopy
  • Regression Analysis
  • Residual Stress
  • Resistance
  • Shot Peening
  • Surface Finishing
  • Surface Properties
  • Tensile Properties
  • Tensile Strength

Fields of Study

  • Materials science

Readers

  • Powder metallurgy of Titanium alloys.

Technology Areas

  • Microelectronics