Manufacturing Methods and Technology for Digital Fault Isolation of Hybrid Microelectronic Assemblies.

Abstract

The HFI program objective was to establish the test and fault isolation requirements for complex digital, hybrid microelectronic assemblies (D/HMAs) of present, and future, production missile electronics. High production rate test and fault isolation of D/HMAs, would use a single probe (Autoprobe or AP) automated for X, Y, Z position, and operating under bus control of an external host computer of ATE system. Project R1023 hardware (HW) and software (SW) were also to be compatible with the ATE system HW and SW previously delivered to MICOM under project R783242. Work Accomplished: Digital Hybrid Microelectronic Assembly (D/HMA) Survey; Autoprobe Positioner Survey; Positioner AP Adaptation; HFI Autoprobe System Overview; Autoprobe Interface Software Elements; Test Candidate Hardware; Test Software; HFI Autoprobe System Data and Performance.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1982
Accession Number
ADA160896

Entities

Organizations

  • Hughes Aircraft Company

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies
  • Materials and Manufacturing Processes
  • Weapons Technologies

DTIC Thesaurus Topics

  • Accuracy
  • Computer Programming
  • Computer Programs
  • Computers
  • Engineering
  • Host Computers
  • Manufacturing
  • Operating Systems
  • Pattern Recognition
  • Power Supplies
  • Recognition
  • Software Design
  • Test And Evaluation
  • Test Equipment
  • Test Fixtures
  • Test Methods
  • Transducers

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Robotics and Automation.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems