Fundamental Studies of the Mechanical Behavior of Microelectronic Thin Film Materials
Abstract
It is appropriate to note that before this research program began, very little work had been done in universities on the mechanical properties of microelectronic thin film materials. As a result, much of our early work involved the development of experimental techniques, such as sub micron indentation and wafer curvature measurement, to study stresses and mechanical properties of thin films on substrates. Interest in these developments is indicated by the accepted publications and invited oral presentations listed at the end of this report. The recent MRS Symposium on Thin Films: Stresses and Mechanical Properties was an outgrowth of the research work started under this grant. Thin films, Microelectronics, Mechanical behavior.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1989
- Accession Number
- ADA206057
Entities
People
- William D. Nix
Organizations
- Stanford University