The Microstructural Basis of Damping in High Damping Alloys

Abstract

The microstructural mechanisms responsible for material damping are analyzed, with emphasis on those mechanisms responsible for the behavior in high damping alloys. A Cu-Al-Ni alloy is metallurgically characterized using transmission electron microscopy and differential scanning calorimetry. The microstructural characterization of the Cu-Mn alloy INCRAMUTE is refined using high resolution transmission electron microscopy and high resolution energy- dispersive x-ray spectroscopy. A qualitative theory for the strain dependence of damping capacity is given. Keywords: Theses; Stress strain relations; Vibration.

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1989
Accession Number
ADA219572

Entities

People

  • Peter F. Rappeline

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Amplitude
  • Chemical Composition
  • Crystal Lattices
  • Crystal Structure
  • Domain Walls
  • Electron Microscopes
  • Engineering
  • High Resolution
  • Internal Friction
  • Materials
  • Mechanical Engineering
  • Microscopes
  • Microstructure
  • Phase Diagrams
  • Phase Transformations
  • Plastic Deformation
  • X Rays

Fields of Study

  • Materials science

Readers

  • Control Systems Engineering.
  • Powder metallurgy of Titanium alloys.

Technology Areas

  • Microelectronics