Prediction and Control of Processing-Induced Residual Stresses in Composites. Part 2. AS4/PEEK Composite
Abstract
Residual stresses in symmetric cross-ply laminates were monitored by measuring the dimensionless curvature. The cooling rate was found to have a significant influence on the amount of residual stress in graphite/PEEK (APC-2) laminates. The transverse strain due to crystallization was not negligible and must be considered when predicting residual stresses for cooling rates of 75 deg C/min and lower. The stress-free temperature for O3/90(3) APC-2 laminates decreases with increasing cooling rate. Successive unconstrained heating/cooling provided the necessary environment for less stress relaxation allowing the specimens to move toward an equilibrium stress-free temperature (SFT) of 328 deg C. The SFT for any heating cycle was found to be equivalent to the previous cooling cycle SFT. The SFT is strongly dependent on geometrical constraint during thermal cycling because of the stress relaxation.
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 01, 1989
- Accession Number
- ADA223696
Entities
People
- H. T. Hahn
- K. J. Schulte
Organizations
- Pennsylvania State University