Hybrid PV HgCdTe Detectors: Technology Reliability and Failure Physics Program

Abstract

Hg(1-x)Cd(x)Te focal planes are finding greater application in systems designed to operate in the medium wave (MW) and long wave (LW) infrared bands. Prior to those focal planes being deployed in the field, it is important to understand the potential failure mechanisms to permit high reliability units to be built. Indium bump bonding (also known as flip-chip bonding or hybridization) is a widespread method for providing electrical interconnect and mechanical support of these focal planes to circuit boards or silicon (Si) multiplexers. This program was designed to evaluate the effect of the hybridization process on MW focal planes, as well as to assess their long term stability. (RRH)

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1988
Accession Number
ADA226675

Entities

People

  • John W. Marciniec

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms

DTIC Thesaurus Topics

  • Chemistry
  • Circuit Boards
  • Cold Welding
  • Detectors
  • Efficiency
  • Electrical Properties
  • Fabrication
  • Failure Analysis
  • Failure Mode And Effect Analysis
  • Focal Plane Arrays
  • Focal Planes
  • Materials
  • Measurement
  • Quantum Efficiency
  • Reliability
  • Space Charge
  • Thermal Expansion

Readers

  • Integrated Circuit Design and Technology.
  • Optical Physics and Photonics.