Tailored Interfaces for Metal-Matrix Composites-Fundamental Considerations

Abstract

The objective of this research is to determine the interface properties needed for successful metal matrix composites and to learn how to achieve these properties. A number of factors have been selected for the study. These are thermodynamic stability of the interface, nature of the bonding across the interface, energy and structure of the interface, and role of adsorption at the interface. A number of systems have been chosen to probe these factors; namely, Al/TiC, Al/alpha-Al2O3, A1/MgAl2O4(spinel), Al/Al3(Tix, Zr1-x), Mg/SiC, Mg/MgO, and Mg/Al2O3. Techniques for preparing all of these composites have been worked out, including mechanical alloying followed by extrusion, arc melting, and liquid metal infiltration. MMCs also were obtained from Martin Marietta and Dow. Microstructures of the resulting MMCs are presented and discussed along with preliminary studies of some of the interfaces using transmission electron microscopy. In comparison to Al/SiC, Al/TiC and Mg/SiC show no evidence of chemical reaction at the interface during processing. Al/MgAl2O4(spinel) has superior mechanical properties to Al/alpha-AlO3, both prepared identically. (Author) (tr)

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Document Details

Document Type
Technical Report
Publication Date
Oct 31, 1990
Accession Number
ADA229143

Entities

People

  • Julia R. Weertman
  • Morris E. Fine

Organizations

  • Northwestern University

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Space

DTIC Thesaurus Topics

  • Ceramic Materials
  • Chemical Reactions
  • Chemical Synthesis
  • Chemistry
  • Composite Materials
  • Materials
  • Materials Engineering
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Mechanical Properties
  • Mechanical Working
  • Mechanics
  • Metal Matrix Composites
  • Metallurgy
  • Modulus Of Elasticity
  • Students

Fields of Study

  • Materials science

Readers

  • Reinforced Composite Materials
  • Systems Analysis and Design
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics