Effect of Excess Oxydianiline on the Properties of Polyimide
Abstract
Thin films of the polymer polyimide (PI) can be grown in ultra-high vacuum by codeposition of pyromellitic dianhydride (PMDA) and oxydianiline (ODA). Raman spectroscopy was used to characterise the effects of non-stoichiometric deposition rates and substrate temperature on the chemical properties of the resulting PI film. Low fluxes and excess PMDA yield PI formation. High fluxes and excess PMDA thus ruling out the possibility of a one step process for PI formation. Defects that develop during processing of the polymer polyimide can adversely alter the dielectric properties and adhesion of polyimide thin films which are widely used, for semiconductors. Polyimide films can be cast or spin coated from solution or formed by direct vapor deposition.
Document Details
- Document Type
- Technical Report
- Publication Date
- May 15, 1991
- Accession Number
- ADA237467
Entities
People
- C. M. Carlin
- R. G. Pethe
- W. N. Unertl
Organizations
- University of Maine